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CSPEMI201A 2 Channel Headset Speaker EMI Filter with ESD Protection
Features
* * * * * * * * * * Two channels of EMI filtering Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 40dB attenuation at 1GHz +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection in each channel (HBM) Supports AC signals--ideal for audio applications Extremely low lead inductance for optimum filter and ESD performance 5-bump, 0.950mm X 1.410mm footprint Chip Scale Package (CSP) Lead-free version available
Product Description
The CSPEMI201A is a dual low-pass filter array integrating two pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom-designed to interface with a speaker port on a cellular telephone or similar device. Each high quality filter provides more than 35dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from a speaker element. They also support bipolar signals with a cutoff frequency of 31MHz, enabling audio signals to pass through without distortion. In addition, the CSPEMI201A provides a very high level of protection for sensitive electronic components that may be subjected to electrostatic discharge (ESD). The CSPEMI201A can safely dissipate ESD strikes of 8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MIL-STD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than 15kV. The CSPEMI201A is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI201A is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
Applications
* * * * * * * EMI filtering and ESD protection for headset speaker ports Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Camcorders Notebooks Desktop PCs
Electrical Schematic
SPKR_IN1 A1 10 C1 100pF SPKR_OUT1
100pF
SPKR_IN2
A3
10
C3 100pF
SPKR_OUT2
100pF
GND
B2
(c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
1
CSPEMI201A
PACKAGE / PINOUT DIAGRAMS
TOP VIEW (Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW (Bumps Up View)
SPKR_OUT1 SPKR_OUT2
123 A B C
C1 C3
GND
AB
B2 Pin "A1" Marking
SPKR_IN1 SPKR_IN2
A1
A3
A1
Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CSPEMI201A CSP Package
PIN DESCRIPTIONS
PIN A1 A3 B2 C1 C3 NAME SPKR_IN1 SPKR_IN2 GND SPKR_OUT1 SPKR_OUT2 DESCRIPTION Speaker Input 1 (from audio circuitry) Speaker Input 2 (from audio circuitry) Device Ground Speaker Output 1 (to speaker) Speaker Output 2 (to speaker)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Pins 5 Package CSP Number1 CSPEMI201A Part Marking AB Lead-free Finish2 Ordering Part Number1 CSPEMI201AG Part Marking AB
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2003 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/09/03
CSPEMI201A
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 200 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R C ILEAK VSIG PARAMETER Resistance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency ZSOURCE = 50, ZLOAD = 50 VIN=5.0V ILOAD = 10mA 5 -5 Notes 2,4 and 5 15 8 Notes 2,3,4 and 5 +15 -19 R = 10, C = 100pF 31 V V MHz kV kV 7 -10 15 -15 V V CONDITIONS MIN 9 80 TYP 10 100 MAX 11 120 1.0 UNITS pF A
VESD
VCL
fC
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: These parameters are guaranteed by design and characterization.
(c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
L Tel: 408.263.3214
L
Fax: 408.263.7846
L
www.calmicro.com
3
CSPEMI201A
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Insertion Loss VS. Frequency (A1-C1 to GND B2)
Figure 2. Insertion Loss VS. Frequency (A3-C3 to GND B2)
(c) 2003 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/09/03
CSPEMI201A
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 3. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 4. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2003 California Micro Devices Corp. All rights reserved. 10/09/03
Figure 5. Lead-free (SnAgCu) Solder Ball Reflow Profile
L Tel: 408.263.3214 L Fax: 408.263.7846 L www.calmicro.com
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
5
CSPEMI201A
Mechanical Details
CSP Mechanical Specifications CSPEMI201A devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B2 B1 B4 B3
SIDE VIEW
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 0.905 1.365 0.495 0.245 0.430 0.430 0.175 0.220 0.561 0.355 Nom 0.950 1.410 0.500 0.250 0.435 0.435 0.225 0.270 0.605 0.380 Max 0.995 1.455 0.505 0.255 0.440 0.440 0.275 0.320 0.649 0.405 Min Custom CSP 5 Inches Nom Max 0.0356 0.0374 0.0392 0.0537 0.0555 0.0573 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0069 0.0089 0.0108 0.0087 0.0106 0.0126 0.0221 0.0238 0.0255 0.0140 0.0150 0.0159 3500 pieces
C A2 B A 123
0.30 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
DIMENSIONS IN MILLIMETERS
Package Dimensions for CSPEMI201A Chip Scale Package
C2
D1
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CSPEMI201A CHIP SIZE (mm) 1.41 X 0.95 X 0.6 POCKET SIZE (mm) B0 X A0 X K0 1.52 X 1.07 X 0.72
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W
Ko
Bo
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 6. Tape and Reel Mechanical Data
(c) 2003 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 L Tel: 408.263.3214
L Fax: 408.263.7846
L
www.calmicro.com
10/09/03

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